课程说明及重点

高压制程电子产品一般最大的可靠性问题是静电放电(ESD) 很差、闩锁(LU)能力也很差，而且模拟高压电路输出端口又会占很大面积，这会影响使其ESD能力通常非常不佳。ESD)/LU破坏是影响IC可靠性的重要因素也是延缓产品上市的主因，因此无论由制程上、设计上全方位的防护措施是必要的。本课程是高压集成IC ESD/LU防护设计上之实务课程，更是各高压集成IC产品ESD可靠度防护上最热门的技术。

本课程将从各种HV CMOS元器件、晶圆厂技术平台、HV组件的汲极工程、高压元器件ESD/LU能力如何测试介绍起，进而谈论HV CMOS 的各电性、可靠度缺点、晶圆厂HV ESD/LU 防护设计法则及各种ESD/LU保护策略及如何保护HV LDMOS与HV 集成电路ESD/LU防护实际案例分析，最后期许学员能对HV制程工艺及组件结构充分理解，并熟悉HV IC静电防护及LU免疫设计之防制意义。

授课对象

现职从事模拟IC与电子产品之RD设计、布局、制造、产品应用与品管、品保、FA相关技术人员 (对ESD/LU防护已有认识者)。

课程大纲

第一阶段 :

I. High-Voltage CMOS Devices

◎ What’s an HV Technology ?

◎ How These Products Use the HV Process ?

◎ Foundry Technology Platform

II. Device Engineering for HV Devices

◎ Basic Concepts of an HV IC

◎ Well Engineerings

◎ Electrical Behaviors

III. HV ESD/LU Testing Issues

◎ How to Do an HV IC ESD Testing ?

◎ How to Do an HV IC Latch-up Testing ?

第二阶段:

III. Weakness Issues in the HV CMOS Process

◎ High Resistive ESD Element Influence

◎ Intrinsic HV nMOS Reliability Problem

◎ Why ESD Level of the HV-CMOS I/O Protection Circuit is So Bad ?

◎ How About the Occurred Failure Mode in the HV CMOS ?

◎ HV Multi-Finger O/P nMOS Driver Protection Challenge

◎ Impact of Low-Holding-Voltage Issue in HV CMOS Technology

IV HV ESD/LU Rules (ex: 5V/30V/40V)

◎ Foundry HV ESD Design Rules

◎ Foundry HV LU Design Rules

V. Some Strategies of ESD/LU Protection Design in a HV CMOS Process

◎ How to Improve Low Vh ?

◎ How to Adjust Vt1 ?

◎ How to Guarantee That Vt2 >Vt1 ?

◎ How About the Single Finger Width Effect ?

◎ Which One Device Is More Better ?

◎ How About the N-Well Effect in a HV Drain Side ?

Day 3:

VI. How to Protect the HV LDMOS?

◎How to Do a Good ESD Immunity in the HV LDMOS?

◎ESD Protection Methods & Patents for the HV LDMOS

VII. (HV ESD/LU Cases Study)

VIII. Summary